JPS63143872U - - Google Patents
Info
- Publication number
- JPS63143872U JPS63143872U JP1987035521U JP3552187U JPS63143872U JP S63143872 U JPS63143872 U JP S63143872U JP 1987035521 U JP1987035521 U JP 1987035521U JP 3552187 U JP3552187 U JP 3552187U JP S63143872 U JPS63143872 U JP S63143872U
- Authority
- JP
- Japan
- Prior art keywords
- frame
- cable connector
- circuit board
- printed circuit
- legs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007598 dipping method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987035521U JPS63143872U (en]) | 1987-03-11 | 1987-03-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987035521U JPS63143872U (en]) | 1987-03-11 | 1987-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63143872U true JPS63143872U (en]) | 1988-09-21 |
Family
ID=30845096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987035521U Pending JPS63143872U (en]) | 1987-03-11 | 1987-03-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63143872U (en]) |
-
1987
- 1987-03-11 JP JP1987035521U patent/JPS63143872U/ja active Pending